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BGA X-ray Inspection is a very important and necessary process that helps to find and remove the defects before final assembly. X-ray inspection is a technology based on automated optical inspection (AOI). The inspection using X-rays focuses on voiding levels in the solder joints as well as ensuring proper connections between the BGA component and the PCB. This also helps to check for Shorts Post Reflow and Consistent Reflow underneath the Entire Package etc. Read this blog to know the importance or reasons to inspect BGA’s using X-rays.

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